Bozo
Storage? I am Storage!
Is your motherboard hanging on a wall outside?
Since you don't use cases, just mount the motherboard as the bottom component in a chimney, with the board upside down. Any condensation can go into a 'drip bucket'.
Peltiers are WAY cooler then water cooling;0
Why in Hell are you watercooling a drive that dissipates something like 2.5W?CPU->NB->5870#1->5870#2->SSD->Pump->Radiator
I think he's referring to cooling the integrated OCZ 512GB PCI-E controller/drive combo.
With DDR2 you could get RAM with water blocks built in. Can you do the same for DDR3?
Checkout www.koolance.com. They have RAM water blocks for DDR3.
Why worry about the RAM? Manufacturers usually quote ambient operating temperature ranges of up 65 or 70C - the chips themselves may run at up to 95C, or in come cases, even 125C!
Think about it, even CPUs can be rated up to 90C.
Surely everyone realizes that RAM heatsinks are just for show?
Whilst most are indeed for show, I thought the heatspreaders common in FB-DIMMS served a functional purpose to spread the heat load of the AMB chip, to avoid meltdowns?
[url=http://www.bresink.com/osx/0TemperatureMonitor/issues.html]the Marcel Bresink Temperature Monitor FAQ[/url] said:I get readings of more than 90°C (194°F) for the FB-DIM modules in my Mac Pro. Isn't this a bit high?
No, temperatures in that range are normal for FB-DIMMs and are no cause for concern. Each FB-DIMM contains its own controller, called "Advanced Memory Buffer (AMB)". An AMB also contains an internal sensor which measures temperature directly inside the chip. The specified maximum temperature range of an FB-DIMM, measured by the AMB, usually lies in the interval between 95°C and 125°C (203°F .. 257°F). It will vary from manufacturer to manufacturer, a typical value is 110°C (230°F).
And yet component lifetime is shortened by high temperature...
And yet component lifetime is shortened by high temperature...
In effect, he is trying to heat the water, with the heat from the water block.
...
Exactly! The closer the water and the water block come to the same temperature, the slower the heat transfer. The idea is to regulate the flow to get the maximum heat transfer from the water block to the water.
If the water enters the water block at 50F and leaves at 55F, thats good. If the water enters at 50F and leaves at 60F, that's better. The idea is to regulate the flow to get the maximum heat transfer while still reducing the CPU temp. At some point the temperature differential will stop climbing and the CPU temp will stop dropping. He might even need to increase the water flow.
No. Take a look at the Arrhenius equation and how it pertains to semiconductors and accelerated life testing at high temperature. This is a good paper explaining some of it.That is more the thermal cycling than the high temps on their own, no?