I'm sure it's great in a server. Unfortunately neither Intel nor the AMD have implemented it in the enthusiast motherboards.
It's highly likely it'll still work. Just take the board out of the enclosure and let it dry thoroughly for a few days. Electronics and water are mainly a problem if they sit in water for more than a few days. A wash/rinse cycle doesn't qualify. That's not long enough for the water to start to corrode things. If you're lucky the drive may even have a conformal coating to protect it from humidity. That in theory should mean no issues being in water for a short time.This is an 860 EVO 2TB M.2 drive in a USB-C enclosure that is no longer available.
I put the SSD and circuit board into the desiccator with Co indicating silica gel. I don't have molecular sieves or P2O5 handy.
How much of a gap? Heat sink compound is generally designed to be used only to fill very thin gaps on the order of a few thousandths of an inch. If used in thicker layers, there might be too much thermal impedance.Can I put compound on it to fill the gap or is that not stable?
I guess it'll be OK. We're not talking about high power level per square mm like a microprocessor. Like you said, anything is better than air.The pads are like 1mm or so. If there is <1mm of goop is that better or worse than 1mm of pad?
I know that anything will be better than AIR that is there now.